Volume 22 (1983)

Part 1: Regular Papers, Short Notes, and Review Papers

No. 1 pp. 1–206 (Jan 20)
No. 2 pp. 207–372 (Feb 20) Invited Revew Paper included
No. 3 pp. 375–547 (Mar 20) Invited Revew Paper included
No. 4 pp. 549–764 (Apr 20) Invited Revew Paper included
No. 5 pp. 767–893 (May 20)
No. 6 pp. 895–1072 (Jun 20)
No. 7 pp. 1073–1226 (Jul 20)
No. 8 pp. 1227–1348 (Aug 20)
No. 9 pp. 1349–1468 (Sep 20)
No. 10 pp. 1469–1630 (Oct 20)
No. 11 pp. 1631–1747 (Nov 20) Invited Revew Paper included
No. 12 pp. 1749–1935 (Dec 20)

Part 2: Letters

No. 1 pp. L1–L59 (Jan 20)
No. 2 pp. L61–L126 (Feb 20)
No. 3 pp. L127–L205 (Mar 20)
No. 4 pp. L207–L266 (Apr 20)
No. 5 pp. L267–L323 (May 20)
No. 6 pp. L325–L378 (Jun 20)
No. 7 pp. L379–L478 (Jul 20)
No. 8 pp. L479–L549 (Aug 20)
No. 9 pp. L551–L607 (Sep 20)
No. 10 pp. L609–L669 (Oct 20)
No. 11 pp. L671–L756 (Nov 20)
No. 12 pp. L757–L817 (Dec 20)

Supplement

Suppl. 22-1 Proc. 14th Conf. (1982 Int.) Solid State Devices, Tokyo, 1982
Suppl. 22-2 Proc. 14th Meet. Ferroelectric Materials and Their Applications, Kyoto, 1983
Suppl. 22-3 Proc. 3rd Symp. Ultrasonic Electronics, Tokyo, 1982