Volume 33 (1994)

Part 1: Regular Papers, Short Notes, and Review Papers

No. 1A pp. 1–363 (Jan 15)
No. 1B pp. 365–941 (Jan 30) Solid State Devices and Materials
No. 2 pp. 943–1215 (Feb 15)
No. 3A pp. 1217–1584 (Mar 15)
No. 3B pp. 1585–1712 (Mar 30) Atomic Frequency Standards and Coherent Quantum Electronics
No. 4A pp. 1713–2131 (Apr 15)
No. 4B pp. 2133–2438 (Apr 30) Dry Process / Silicon Molecular Beam Epitaxy
No. 5A pp. 2439–2831 (May 15)
No. 5B pp. 2833–3304 (May 30) Ultrasonic Electronics
No. 6A pp. 3305–3655 (Jun 15)
No. 6B pp. 3657–3790 (Jun 30) Scanning Tunneling Microscopy
No. 7A pp. 3791–4156 (Jul 15) Invited Revew Paper included
No. 7B pp. 4157–4490 (Jul 30) Plasma Processing
No. 8 pp. 4491–4798 (Aug 15)
No. 9A pp. 4801–5117 (Sep 15)
No. 9B pp. 5119–5576 (Sep 30) Ferroelectric Materials & Their Applications
No. 10 pp. 5577–6072 (Oct 15) Invited Revew Paper included
No. 11 pp. 6075–6423 (Nov 15)
No. 12A pp. 6425–6745 (Dec 15)
No. 12B pp. 6747–l;7231 (Dec 30) MicroProcess

Part 2: Letters

No. 1A pp. L1–L77 (Jan 15)
No. 1B pp. L79–L151 (Jan 15)
No. 2A pp. L153–L206 (Feb 1)
No. 2B pp. L207–L262 (Feb 15)
No. 3A pp. L263–L397 (Mar 1)
No. 3B pp. L399–L481 (Mar 15)
No. 4A pp. L483–L558 (Apr 1)
No. 4B pp. L559–L619 (Apr 15)
No. 5A pp. L621–L695 (May 1)
No. 5B pp. L697–L762 (May 15)
No. 6A pp. L763–L816 (Jun 1)
No. 6B pp. L817–L897 (Jun 15)
No. 7A pp. L899–L974 (Jul 1)
No. 7B pp. L977–L1048 (Jul 15)
No. 8A pp. L1049–L1130 (Aug 1)
No. 8B pp. L1131–L1194 (Aug 15)
No. 9A pp. L1195–L1288 (Sep 1)
No. 9B pp. L1289–L1361 (Sep 15)
No. 10A pp. L1363–L1434 (Oct 1)
No. 10B pp. L1435–L1505 (Oct 15)
No. 11A pp. L1507–L1570 (Nov 1)
No. 11B pp. L1571–L1644 (Nov 15)
No. 12A pp. L1645–L1731 (Dec 1)
No. 12B pp. L1733–L1808 (Dec 15)