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Japanese Journal of Applied Physics

Volume 50, Number 5, May 2011

Special Issue: Advanced Metallization for ULSI Applications

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• Metals and barriers
• Dielectric materials
• Planarization technology
• 3D integration
• MEMS
• Nano devices and processes

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Metals and barriers

05EA01 : Comparison of Process Options for Improving Backend-of-Line Reliability in 28 nm Node Technologies and Beyond

Oliver Aubel, Christian Hennesthal, Meike Hauschildt, Jens Poppe, Jens Hahn, Juergen Boemmels, Markus Nopper, and Robert Seidel
Published May 20, 2011 (6 pages)
[Abstract] [Full Text PDF (983K)]

05EA02 : Role of Impurity Segregation into Cu/Cap Interface and Grain Boundary in Resistivity and Electromigration of Cu/Low-k Interconnects

Shinji Yokogawa and Yumi Kakuhara
Published May 20, 2011 (7 pages)
[Abstract] [Full Text PDF (1459K)]

05EA03 : Improved Step Coverage of Cu Seed Layers by Magnetic-Field-Assisted Ionized Sputtering

Yuta Sakamoto, Koukichi Kamada, Junichi Hamaguchi, Akifumi Sano, Yukinobu Numata, Shuji Kodaira, Satoru Toyoda, and Koukou Suu
Published May 20, 2011 (3 pages)
[Abstract] [Full Text PDF (461K)]

05EA04 : New Copper Alloy, Cu(SnN_x), Films Suitable for More Thermally Stable, Electrically Reliable Interconnects and Lower-Leakage Current Capacitors

Chon-Hsin Lin
Published May 20, 2011 (5 pages)
[Abstract] [Full Text PDF (676K)]

05EA05 : Prediction of Stress Induced Voiding Reliability in Cu Damascene Interconnect by Computer Aided Vacancy Migration Analysis

Haruhisa Shigeyama, Takenao Nemoto, A. Toshimitsu Yokobori, and
Published May 20, 2011 (6 pages)
[Abstract] [Full Text PDF (1212K)]

05EA06 : Atomic Layer Deposition of Thin VN_x Film from Tetrakis(diethylamido)vanadium Precursor

Mayumi B. Takeyama, Masaru Sato, Hiroshi Sudoh, Hideaki Machida, Shun Ito, Eiji Aoyagi, and Atsushi Noya
Published May 20, 2011 (2 pages)
[Abstract] [Full Text PDF (425K)]

05EA07 : Barrier Properties of Thin ZrN_x Films Prepared by Radical-Assisted Surface Reaction

Masaru Sato, Mayumi B. Takeyama, Yuichirou Hayasaka, Eiji Aoyagi, and Atsushi Noya
Published May 20, 2011 (2 pages)
[Abstract] [Full Text PDF (367K)]

05EA08 : Ru/WN_x Bilayers as Diffusion Barriers for Cu Interconnects

Windu Sari, Tae-Kwang Eom, Sang-Hyeok Choi, and Soo-Hyun Kim
Published May 20, 2011 (4 pages)
[Abstract] [Full Text PDF (819K)]

05EA09 : Formation of Palladium Silicide Thin Layers on Si(110) Substrates

Risa Suryana, Osamu Nakatsuka, and Shigeaki Zaima
Published May 20, 2011 (5 pages)
[Abstract] [Full Text PDF (1196K)]

05EA10 : Mechanism Verification of Electrochemical Migration of Fine Cu Wiring

Daiki Komatsu, Nobuya Takahashi, Toshiki Furutani, Ramesh Kumar Bhandari, Kenji Sato, Naoyuki Jinbo, and Takashi Kariya
Published May 20, 2011 (2 pages)
[Abstract] [Full Text PDF (501K)]

Dielectric materials

05EB01 : Isobutyl Silane Precursors for SiCH Low-k Cap Layer beyond the 22 nm Node: Analysis of Film Structure for Compatibility of Lower k-value and High Barrier Properties

Hideharu Shimizu, Nobuo Tajima, Takeshi Kada, Shuji Nagano, and Yukihiro Shimogaki
Published May 20, 2011 (6 pages)
[Abstract] [Full Text PDF (1258K)]

05EB02 : Electrical Characteristics of Novel Non-porous Low-k Dielectric Fluorocarbon on Cu Interconnects for 22 nm Generation and Beyond

Xun Gu, Takenao Nemoto, Yugo Tomita, Akihide Shirotori, Kotaro Miyatani, Akane Saito, Yasuo Kobayashi, Akinobu Teramoto, Shin-Ichiro Kuroki, Toshihisa Nozawa, Takaaki Matsuoka, Shigetoshi Sugawa, and Tadahiro Ohmi
Published May 20, 2011 (5 pages)
[Abstract] [Full Text PDF (855K)]

05EB03 : Evaluation of a New Advanced Low-k Material

Evgeny A. Smirnov, Kris Vanstreels, Patrick Verdonck, Ivan Ciofi, Denis Shamiryan, Mikhail R. Baklanov, and Mark Phillips
Published May 20, 2011 (5 pages)
[Abstract] [Full Text PDF (942K)]

05EB04 : Effects of Postetching Treatment on Molecular-Pore-Stacking/Cu Interconnects for 28 nm Node and Beyond

Daisuke Oshida, Ippei Kume, Hirokazu Katsuyama, Toshiji Taiji, Takuya Maruyama, Makoto Ueki, Naoya Inoue, Manabu Iguchi, Kunihiro Fujii, Noriaki Oda, and Michio Sakurai
Published May 20, 2011 (6 pages)
[Abstract] [Full Text PDF (1072K)]

05EB05 : Influence of the UV Cure on Advanced Plasma Enhanced Chemical Vapour Deposition Low-k Materials

Patrick Verdonck, Els Van Besien, Kris Vanstreels, Christos Trompoukis, Adam Urbanowicz, David De Roest, and Mikhail R. Baklanov
Published May 20, 2011 (5 pages)
[Abstract] [Full Text PDF (328K)]

05EB06 : Structure-Modification Model of Porogen-Based Porous SiOC Film with Ultraviolet Curing

Yoshihiro Oka, Akira Uedono, Kinya Goto, Yukinori Hirose, Masazumi Matsuura, Masahiko Fujisawa, and Koyu Asai
Published May 20, 2011 (5 pages)
[Abstract] [Full Text PDF (823K)]

05EB07 : Analysis of Sidewall Damage Layer in Low-k Film Using the Interline Dielectric Capacitance Measurements

Takahisa Furuhashi, Nobuto Nakanishi, Masahiro Matsumoto, Shigenori Kido, Masakazu Okada, Yuichi Kawano, Yukinori Hirose, Masahiko Fujisawa, and Koyu Asai
Published May 20, 2011 (5 pages)
[Abstract] [Full Text PDF (1165K)]

05EB08 : Effectiveness of Dimethyl Carbonate and Dipivaloyl Methane Chemicals for Internal Repair of Plasma-Damaged Low-k Films

Shuji Nagano, Kaoru Sakoda, Satoshi Hasaka, and Kiyoteru Kobayashi
Published May 20, 2011 (5 pages)
[Abstract] [Full Text PDF (1247K)]

Planarization technology

05EC01 : Analysis of A Novel Slurry Injection System in Chemical Mechanical Planarization

Anand Meled, Yun Zhuang, Yasa Adi Sampurno, Siannie Theng, Yubo Jiao, Leonard Borucki, and Ara Philipossian
Published May 20, 2011 (5 pages)
[Abstract] [Full Text PDF (667K)]

05EC02 : Tribological, Thermal, and Kinetic Characterization of 300-mm Copper Chemical Mechanical Planarization Process

Yubo Jiao, Yasa Adi Sampurno, Yun Zhuang, Xiaomin Wei, Anand Meled, and Ara Philipossian
Published May 20, 2011 (6 pages)
[Abstract] [Full Text PDF (1177K)]

05EC03 : Slurry Supplying Method for Large Quartz Glass Substrate Polishing

Panart Khajornrungruang, Keiichi Kimura, Ryuji Yui, Nagisa Wada, and Keisuke Suzuki
Published May 20, 2011 (2 pages)
[Abstract] [Full Text PDF (629K)]

05EC04 : Electrochemical Reactions During Ru Chemical Mechanical Planarization and Safety Considerations

Shohei Shima, Yutaka Wada, Katsuhiko Tokushige, Akira Fukunaga, and Manabu Tsujimura
Published May 20, 2011 (2 pages)
[Abstract] [Full Text PDF (413K)]

05EC05 : Diamond Conditioner Microwear Effect on Pad Surface Height Distribution in Tungsten Chemical Mechanical Polishing

Yohei Yamada, Masanori Kawakubo, and Kazunori Kadomura
Published May 20, 2011 (6 pages)
[Abstract] [Full Text PDF (1201K)]

05EC06 : Study of Cu-Inhibitor State for Post-Chemical Mechanical Polishing Cleaning

Ken Harada, Atsushi Ito, Yasuhiro Kawase, Toshiyuki Suzuki, Makoto Hara, Rina Sakae, Chiharu Kimura, and Hidemitsu Aoki
Published May 20, 2011 (4 pages)
[Abstract] [Full Text PDF (717K)]

05EC07 : Tribological Effects of Brush Scrubbing in Post Chemical Mechanical Planarization Cleaning on Electrical Characteristics in Novel Non-porous Low-k Dielectric Fluorocarbon on Cu Interconnects

Xun Gu, Takenao Nemoto, Yugo Tomita, Akinobu Teramoto, Shigetoshi Sugawa, and Tadahiro Ohmi
Published May 20, 2011 (6 pages)
[Abstract] [Full Text PDF (919K)]

05EC08 : Disappearance of Barrier Metal during Cu Chemical Mechanical Planarization Processing and Its Mechanism

Hiroshi Asano, Akihito Yasui, Tatsuhiko Hirano, Kazusei Tamai, and Hitoshi Morinaga
Published May 20, 2011 (2 pages)
[Abstract] [Full Text PDF (512K)]

05EC09 : Development of Original End Point Detection System Utilizing Eddy Current Variation Due to Skin Effect in Chemical Mechanical Polishing

Takashi Fujita, Keita Kitade, and Toshiyuki Yokoyama
Published May 20, 2011 (6 pages)
[Abstract] [Full Text PDF (1016K)]

05EC10 : Application of Novel Ultrasonic Cleaning Equipment That Uses the Waveguide Mode for the Single-Wafer Cleaning Process

Kazunari Suzuki, Yasuhiro Imazeki, Ki Han, Shoichi Okano, Junichiro Soejima, and Yoshikazu Koike
Published May 20, 2011 (5 pages)
[Abstract] [Full Text PDF (935K)]

3D integration

05ED01 : Formation and Evaluation of Electroless-Plated Barrier Films for High-Aspect-Ratio Through-Si Vias

Hiroshi Miyake, Fumihiro Inoue, Takumi Yokoyama, Tomohiro Shimizu, Shukichi Tanaka, Toshifumi Terui, and Shoso Shingubara
Published May 20, 2011 (5 pages)
[Abstract] [Full Text PDF (861K)]

05ED02 : Diffusion Resistance of Low Temperature Chemical Vapor Deposition Dielectrics for Multiple Through Silicon Vias on Bumpless Wafer-on-Wafer Technology

Hideki Kitada, Nobuhide Maeda, Koji Fujimoto, Yoriko Mizushima, Yoshihiro Nakata, Tomoji Nakamura, and Takayuki Ohba
Published May 20, 2011 (4 pages)
[Abstract] [Full Text PDF (883K)]

05ED03 : Characterization of Local Strain around Through-Silicon Via Interconnects by Using X-ray Microdiffraction

Osamu Nakatsuka, Hideki Kitada, Youngsuk Kim, Yoriko Mizushima, Tomoji Nakamura, Takayuki Ohba, and Shigeaki Zaima
Published May 20, 2011 (4 pages)
[Abstract] [Full Text PDF (614K)]

05ED04 : Development of High-Speed Copper Chemical Mechanical Polishing Slurry for Through Silicon Via Application Based on Friction Analysis Using Atomic Force Microscope

Jin Amanokura, Hiroshi Ono, and Kyoko Hombo
Published May 20, 2011 (4 pages)
[Abstract] [Full Text PDF (430K)]

MEMS

05EE01 : A Study of Digitally Controllable Radio Frequency Micro Electro Mechanical Systems Inductor

Atsushi Shirane, Yutaka Mizuochi, Shuhei Amakawa, Noboru Ishihara, and Kazuya Masu
Published May 20, 2011 (3 pages)
[Abstract] [Full Text PDF (578K)]

Nano devices and processes

05EF01 : Improvement in Electrical Properties of Carbon Nanotube Via Interconnects

Masayuki Katagiri, Yuichi Yamazaki, Makoto Wada, Masayuki Kitamura, Naoshi Sakuma, Mariko Suzuki, Shintaro Sato, Mizuhisa Nihei, Akihiro Kajita, Tadashi Sakai, and Yuji Awano
Published May 20, 2011 (4 pages)
[Abstract] [Full Text PDF (961K)]

05EF02 : Chemical Vapor Deposition of Nanocarbon on Electroless NiB Catalyst Using Ethanol Precursor

Toru Tanaka, Tomomi Sato, Yusuke Karasawa, and Kazuyoshi Ueno
Published May 20, 2011 (5 pages)
[Abstract] [Full Text PDF (961K)]

05EF03 : Iridium Nanocrystal Thin-Film Transistor Nonvolatile Memory with Si₃N₄/SiO₂ Stack of Asymmetric Tunnel Barrier

Terry Tai-Jui Wang, Tien-Lin Lu, Chien-Hung Wu, Yu-Cheng Liu, Shih-Wei Hung, Ing-Jar Hsieh, and Cheng-Tzu Kuo
Published May 20, 2011 (4 pages)
[Abstract] [Full Text PDF (914K)]

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