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Japanese Journal of Applied Physics

Volume 51, Number 5, May 2012

Special Issue: Advanced Metallization for ULSI Applications

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Editors
Foreword

Metals and alloys

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05EA01 : Conformal Copper Coating of True Three-Dimensional Through-Holes Using Supercritical Carbon Dioxide
Mitsuhiro Watanabe, Yuto Takeuchi, Takahiro Ueno, Masahiro Matsubara, Eiichi Kondoh, Satoshi Yamamoto, Naohiro Kikukawa, and Tatsuo Suemasu
Published May 21, 2012 (5 pages)
[Abstract] [Full Text PDF (885K)]
05EA02 : In-situ Spectroscopic Ellipsometry of the Cu Deposition Process from Supercritical Fluids: Evidence of an Abnormal Surface Layer Formation
Takuya Sasaki, Yukihiro Tamegai, Takahiro Ueno, Mitsuhiro Watanabe, Lianhua Jin, and Eiichi Kondoh
Published May 21, 2012 (11 pages)
[Abstract] [Full Text PDF (2077K)]
05EA03 : Adsorption Kinetic Study of Poly(ethylene glycol) during Copper Electrodeposition by a Microfluidic Device
Takeyasu Saito, Yutaka Miyamoto, Sunao Hattori, Naoki Okamoto, and Kazuo Kondo
Published May 21, 2012 (2 pages)
[Abstract] [Full Text PDF (329K)]
05EA04 : Current Induced Grain Growth of Electroplated Copper Film
Liyana Razak, Takamasa Yamaguchi, Seishi Akahori, Hideki Hashimoto, and Kazuyoshi Ueno
Published May 21, 2012 (6 pages)
[Abstract] [Full Text PDF (1681K)]
05EA05 : A Thermally-Reliable, Low-Resistivity Cu(Ir) and Cu(IrN) Alloy Films for Barrierless Cu Metallization
Chon-Hsin Lin
Published May 21, 2012 (5 pages)
[Abstract] [Full Text PDF (612K)]
05EA06 : Oxidation Characteristics of Thin Al–Mo Alloy Films with Various Compositions as Metal Capping Layer on Cu
Mayumi B. Takeyama and Atsushi Noya
Published May 21, 2012 (5 pages)
[Abstract] [Full Text PDF (742K)]

Barrier and cap layers

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05EB01 : Characterization of Chemically Vapor Deposited Manganese Barrier Layers Using X-ray Absorption Fine Structure
James M. Ablett, Christopher J. Wilson, Nguyen Mai Phuong, Junichi Koike, Zsolt Tokei, George E. Sterbinsky, and Joseph C. Woicik
Published May 21, 2012 (3 pages)
[Abstract] [Full Text PDF (632K)]
05EB02 : Atomic Layer Deposited Co(W) Film as a Single-Layered Barrier/Liner for Next-Generation Cu-Interconnects
Hideharu Shimizu, Kaoru Sakoda, Takeshi Momose, and Yukihiro Shimogaki
Published May 21, 2012 (7 pages)
[Abstract] [Full Text PDF (1074K)]
05EB03 : Barrier Integrity of Electroless Diffusion Barriers and Organosilane Monolayer against Copper Diffusion under Bias Temperature Stress
Akiyoshi Mitsumori, Shota Fujishima, and Kazuyoshi Ueno
Published May 21, 2012 (6 pages)
[Abstract] [Full Text PDF (1292K)]
05EB04 : Interfacial Adhesion Energy of Ru–AlO Thin Film Deposited by Atomic Layer Deposition between Cu and SiO2: Effect of the Composition of Ru–AlO Thin Film
Jeong-Kyu Kim, Tae-Hoon Cheon, Soo-Hyun Kim, and Young-Bae Park
Published May 21, 2012 (5 pages)
[Abstract] [Full Text PDF (760K)]

Low-k materials

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05EC01 : Super-Low-k SiOCH Film with Sufficient Film Modulus and High Thermal Stability Formed by Using Admixture Precursor in Neutral-Beam-Enhanced Chemical Vapor Deposition
Akira Wada, Toru Sasaki, Shigeo Yasuhara, and Seiji Samukawa
Published May 21, 2012 (4 pages)
[Abstract] [Full Text PDF (667K)]
05EC02 : Robust Ultralow-k Dielectric (Fluorocarbon) Deposition by Microwave Plasma-Enhanced Chemical Vapor Deposition
Yoshiyuki Kikuchi, Kotaro Miyatani, Yasuo Kobayashi, Kohei Kawamura, Takenao Nemoto, Masahiro Nakamura, Hirokazu Matsumoto, Azumi Ito, Akihide Shirotori, Toshihisa Nozawa, and Takaaki Matsuoka
Published May 21, 2012 (5 pages)
[Abstract] [Full Text PDF (889K)]
05EC03 : Integration Process Development for Improved Compatibility with Organic Non-Porous Ultralow-k Dielectric Fluorocarbon on Advanced Cu Interconnects
Xun Gu, Yugo Tomita, Takenao Nemoto, Kotaro Miyatani, Akane Saito, Yasuo Kobayashi, Akinobu Teramoto, Rihito Kuroda, Shin-Ichiro Kuroki, Kazumasa Kawase, Toshihisa Nozawa, Takaaki Matsuoka, Shigetoshi Sugawa, and Tadahiro Ohmi
Published May 21, 2012 (6 pages)
[Abstract] [Full Text PDF (1025K)]
05EC04 : Impact of Hydrocarbon Control in Ultraviolet-Assisted Restoration Process for Extremely Porous Plasma Enhanced Chemical Vapor Deposition SiOCH Films with k = 2.0
Yosuke Kimura, Dai Ishikawa, Akinori Nakano, Akiko Kobayashi, Kiyohiro Matsushita, David de Roest, and Nobuyoshi Kobayashi
Published May 21, 2012 (6 pages)
[Abstract] [Full Text PDF (1082K)]
05EC05 : Characterization and Control of Nanostructure Size Variation
Nobuhiro Hata and Hiro Akinaga
Published May 21, 2012 (4 pages)
[Abstract] [Full Text PDF (696K)]
05EC06 : Thermal Transient Response and Its Modeling for Joule Heating in Cu/Low-κ Interconnects Under Pulsed Current
Shinji Yokogawa, Hideaki Tsuchiya, and Tatsuo Shimizu
Published May 21, 2012 (4 pages)
[Abstract] [Full Text PDF (769K)]

Nanocarbon interconnects

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05ED01 : A Study on Electrical Resistance of Carbon Nanotubes and Their Metal Contacts Using Simplified Test Structure
Tatsuro Saito, Makoto Wada, Atsunobu Isobayashi, Yuichi Yamazaki, Masayuki Katagiri, Masayuki Kitamura, Ban Ito, Takashi Matsumoto, Naoshi Sakuma, Akihiro Kajita, and Tadashi Sakai
Published May 21, 2012 (4 pages)
[Abstract] [Full Text PDF (876K)]
05ED02 : Fabrication and Characterization of Planarized Carbon Nanotube Via Interconnects
Masayuki Katagiri, Makoto Wada, Ban Ito, Yuichi Yamazaki, Mariko Suzuki, Masayuki Kitamura, Tatsuro Saito, Atsunobu Isobayashi, Atsuko Sakata, Naoshi Sakuma, Akihiro Kajita, and Tadashi Sakai
Published May 21, 2012 (4 pages)
[Abstract] [Full Text PDF (732K)]

MEMS and packaging

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05EE01 : Synchronized Multiple-Array Vibrational Device for Microelectromechanical System Electrostatic Energy Harvester
Kazuyoshi Ono, Norio Sato, Toshishige Shimamura, Mamoru Ugajin, Tomomi Sakata, Shin’ichiro Mutoh, Junichi Kodate, Yoshito Jin, and Yasuhiro Sato
Published May 21, 2012 (6 pages)
[Abstract] [Full Text PDF (1519K)]
05EE02 : Planar Solenoidal Inductor in Radio Frequency Micro-Electro-Mechanical Systems Technology for Variable Inductor with Wide Tunable Range and High Quality Factor
Atsushi Shirane, Hiroyuki Ito, Noboru Ishihara, and Kazuya Masu
Published May 21, 2012 (4 pages)
[Abstract] [Full Text PDF (614K)]
05EE03 : Novel Through Silicon Vias Leakage Current Evaluation Using Infrared-Optical Beam Irradiation
Yoriko Mizushima, Hideki Kitada, Kazushige Koshikawa, Shinsuke Suzuki, Tomoji Nakamura, and Takayuki Ohba
Published May 21, 2012 (4 pages)
[Abstract] [Full Text PDF (1133K)]
05EE04 : Thermomechanical Fatigue Performance of Lead-Free Chip Scale Package Assemblies with Fast Cure and Reworkable Capillary Flow Underfills
Hongbin Shi, Cuihua Tian, and Toshitsugu Ueda
Published May 21, 2012 (8 pages)
[Abstract] [Full Text PDF (1784K)]
05EE05 : Effects of Temperature and Current Stressing on the Intermetallic Compounds Growth Characteristics of Cu Pillar/Sn–3.5Ag Microbump
Byoung-Hyun Kwak, Myeong-Hyeok Jeong, and Young-Bae Park
Published May 21, 2012 (6 pages)
[Abstract] [Full Text PDF (857K)]
05EE06 : Effect of Interfacial Microstructures on the Bonding Strength of Sn–3.0Ag–0.5Cu Pb-Free Solder Bump
Jae-Myeong Kim, Myeong-Hyeok Jeong, Sehoon Yoo, and Young-Bae Park
Published May 21, 2012 (6 pages)
[Abstract] [Full Text PDF (1215K)]

Chemical mechanical polishing

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05EF01 : Influence of Wafer Edge Geometry on Removal Rate Profile in Chemical Mechanical Polishing: Wafer Edge Roll-Off and Notch
Akira Fukuda, Tetsuo Fukuda, Akira Fukunaga, and Manabu Tsujimura
Published May 21, 2012 (5 pages)
[Abstract] [Full Text PDF (911K)]
05EF02 : Performance Evaluation Method of Chemical Mechanical Polishing Pad Conditioner Using Digital Image Correlation Processing
Michio Uneda, Tatsunori Omote, Ken-ichi Ishikawa, Koichiro Ichikawa, Toshiro Doi, Syuhei Kurokawa, and Osamu Ohnishi
Published May 21, 2012 (2 pages)
[Abstract] [Full Text PDF (796K)]
05EF03 : Effect of Groove Pattern of Chemical Mechanical Polishing Pad on Slurry Flow Behavior
Tsutomu Yamazaki, Toshiro K. Doi, Michio Uneda, Syuhei Kurokawa, Osamu Ohnishi, Kiyoshi Seshimo, and Hideo Aida
Published May 21, 2012 (2 pages)
[Abstract] [Full Text PDF (260K)]
05EF04 : Spatial Fourier Transform Analysis of Polishing Pad Surface Topography
Panart Khajornrungruang, Keiichi Kimura, Takahisa Okuzono, Keisuke Suzuki, and Takashi Kushida
Published May 21, 2012 (2 pages)
[Abstract] [Full Text PDF (553K)]
05EF05 : Effects of Atmosphere and Ultraviolet Light Irradiation on Chemical Mechanical Polishing Characteristics of SiC Wafers
Osamu Ohnishi, Toshiro Doi, Syuhei Kurokawa, Tsutomu Yamazaki, Michio Uneda, Tao Yin, Isamu Koshiyama, Koichiro Ichikawa, and Hideo Aida
Published May 21, 2012 (2 pages)
[Abstract] [Full Text PDF (329K)]
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