Jpn. J. Appl. Phys. 22 (1983) pp. L423-L425 |Next Article| |Table of Contents|
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Letter
Lateral Spreads of Be and Si in GaAs Implanted with a Maskless Ion Implantation System
Eizo Miyauchi,
Hiroshi Arimoto,
Yasuo Bamba,
Akira Takamori,
Hisao Hashimoto and
Takao Utsumi
Optoelectronics Joint Research Laboratory
(Received May 2, 1983; accepted for publication June 18, 1983)
Submicron Si and Be ion beams have been implanted into GaAs using a 100 kV maskless ion implantation system with a liquid metal ion source which is capable of emitting double ion species (Si++ and Be++). Both ion beams are implanted at 160 keV with the dose of 1012 to 1015 cm-2. The profiles of the implanted dopants have been estimated by observing the stain etching patterns on the cleaved planes before and after annealing. It has been found that high dose implantation results in a considerable lateral impurity spread of 1 µm or more, even with the focused ion beams having a diameter of 0.1 µm. However, doping of submicron width can be realized with relatively low doses or with shallow implantation.
URL:
http://jjap.jsap.jp/link?JJAP/22/L423/
DOI: 10.1143/JJAP.22.L423
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