Jpn. J. Appl. Phys. 31 (1992) pp. 1258-1266 |Next Article| |Table of Contents|
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Hole Compensation Mechanism of P-Type GaN Films
Shuji Nakamura,
Naruhito Iwasa,
Masayuki Senoh and
Takashi Mukai
Nichia Chemical Industries, Ltd., 491 Oka, Kaminaka, Anan, Tokushima 774
(Received January 13, 1992; accepted for publication February 15, 1992)
Low-resistivity p-type GaN films, which were obtained by N2-ambient thermal annealing or low-energy electron-beam irradiation (LEEBI) treatment, showed a resistivity as high as 1×106 Ω·cm after NH3-ambient thermal annealing at temperatures above 600°C. In the case of N2-ambient thermal annealing at temperatures between room temperature and 1000°C, the low-resistivity p-type GaN films showed no change in resistivity, which was almost constant between 2 Ω·cm and 8 Ω·cm. These results indicate that atomic hydrogen produced by NH3 dissociation at temperatures above 400°C is related to the hole compensation mechanism. A hydrogenation process whereby acceptor-H neutral complexes are formed in p-type GaN films was proposed. The formation of acceptor-H neutral complexes causes hole compensation, and deep-level and weak blue emissions in photoluminescence.
URL:
http://jjap.jsap.jp/link?JJAP/31/1258/
DOI: 10.1143/JJAP.31.1258
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