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Hole Compensation Mechanism of P-Type GaN Films

Shuji Nakamura, Naruhito Iwasa, Masayuki Senoh and Takashi Mukai

Nichia Chemical Industries, Ltd., 491 Oka, Kaminaka, Anan, Tokushima 774

(Received January 13, 1992; accepted for publication February 15, 1992)

Low-resistivity p-type GaN films, which were obtained by N2-ambient thermal annealing or low-energy electron-beam irradiation (LEEBI) treatment, showed a resistivity as high as 1×106 Ω·cm after NH3-ambient thermal annealing at temperatures above 600°C. In the case of N2-ambient thermal annealing at temperatures between room temperature and 1000°C, the low-resistivity p-type GaN films showed no change in resistivity, which was almost constant between 2 Ω·cm and 8 Ω·cm. These results indicate that atomic hydrogen produced by NH3 dissociation at temperatures above 400°C is related to the hole compensation mechanism. A hydrogenation process whereby acceptor-H neutral complexes are formed in p-type GaN films was proposed. The formation of acceptor-H neutral complexes causes hole compensation, and deep-level and weak blue emissions in photoluminescence.

URL: http://jjap.jsap.jp/link?JJAP/31/1258/
DOI: 10.1143/JJAP.31.1258


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