Jpn. J. Appl. Phys. 33 (1994) pp. 5663-5667 |Next Article| |Table of Contents|
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The Effect of Mesh Bias and Substrate Bias on the Properties of a-Si:H Deposited by Triode Plasma Chemical Vapour Deposition
Ian S. Osborne,
Nobuhiro Hata,
Gautam Ganguly and
Akihisa Matsuda
Electrotechnical Laboratory, 1-1-4 Umezono, Tsukuba-shi, Ibaraki 305
(Received June 3, 1994; accepted for publication August 20, 1994)
A new deposition parameter in the plasma enhanced chemical vapour deposition
(PECVD) technique for the control of the optoelectronic properties of hydrogenated
amorphous silicon (a-Si:H) is presented. The technique utilises a triode electrode
configuration with a wire mesh placed between the cathode and anode of a conventional
diode type PECVD system. A dc bias, applied to the mesh, affects the plasma-substrate
distance or the extent of plasma confinement between the mesh and the cathode, and
subtly alters the gas phase chemistry in the plasma. Using this technique, films of
undoped a-Si:H have been deposited with pure silane as the source gas. Our results
show that the defect density, hydrogen content, and hydrogen bonding configuration
are determined by the mesh bias. Measurement of the defect density of the as-grown
films by the constant photocurrent method (CPM) reveals that this technique can be
used to produce high quaility films with low defect density (<5× 1014 cm-3)
by application of an appropriate bias on the mesh during deposition.
URL:
http://jjap.jsap.jp/link?JJAP/33/5663/
DOI: 10.1143/JJAP.33.5663
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