Jpn. J. Appl. Phys. 34 (1995) pp. 5077-5082  |Next Article|  |Table of Contents|
|Full Text PDF (1550K)| |Buy This Article|

Surface Morphologies and Electrical Properties of (Ba, Sr)TiO3 Films Prepared by Two-Step Deposition of Liquid Source Chemical Vapor Deposition

Takaaki Kawahara, Mikio Yamamuka, Akimasa Yuuki, Kouichi Ono

Semiconductor Research Laboratory, Mitsubishi Electric Corporation, 8-1-1 Tsukaguchi-Honmachi Amagasaki, Hyogo 661, Japan

(Received May 23, 1995; accepted for publication June 19, 1995)

Protrusions of (Ba, Sr)TiO3 (BST) crystallites were found to appear on BST film surfaces prepared by liquid source chemical vapor deposition (CVD) at a substrate temperature T s=420° C and a reactor pressure P=1.5 Torr. Such protrusions were successfully suppressed by two-step deposition, where BST films consisted of a buffer layer and a main layer; the buffer layer was a CVD-BST film about 60 Å thick annealed in N2 ambient. By this two-step deposition on Pt electrodes, the BST film properties of equivalent SiO2 thickness t eq=0.56 nm, leakage current J L=1.2×10-8 A/cm2 at +1.1 V and dielectric loss tan δ=0.011 were achieved at a total film thickness of 230 Å, along with a coverage of 80% at a trench of aspect ratio 0.65 and sufficiently low absorption current.

URL: http://jjap.jsap.jp/link?JJAP/34/5077/
DOI: 10.1143/JJAP.34.5077
KEYWORDS:DRAM, capacitor, BST, liquid source CVD, step coverage, two-step deposition, leakage current, absorption current


|Full Text PDF (1550K)| |Buy This Article| Citation:


References | Citing Articles (56)

  1. Y. Ohno, T. Horikawa, H. Shinkawata, K. Kashihara, T. Kuroiwa, T. Okudaira, Y. Hashizume, K. Fukumoto, T. Eimori, T. Shibano, K. Arimoto, H. Itoh, T. Nishimura and H. Miyoshi: 1994 Symp. VLSI Tech. Dig. (1994) p. 149.
  2. N. Mikami, T. Horikawa, T. Makita, K. Sato, T. Kuroiwa, T. Honda and H. Watarai: Ceram. Trans. 43 (1994) 67.
  3. P-Y. Lesaicherre, S. Yamamichi, H. Yamaguchi, K. Takemura, H. Watanabe, K. Tokashiki, K. Satoh, T. Sakuma, M. Yoshida, S. Onishi, K. Nakajima, K. Shibahara, Y. Miyasaka and H. Ono: Dig. Int. Electron Devices Meet., Washington D.C., 1994 (IEEE, New York, 1994) p. 831.
  4. T. Kawahara, M. Yamamuka, T. Makita, J. Naka, A. Yuuki, N. Mikami and K. Ono: Jpn. J. Appl. Phys. 33 (1994) 5129[JSAP].
  5. T. Kawahara, M. Yamamuka, A. Yuuki and K. Ono: 1994 MRS Fall Meet. I2-6.5.
  6. P. C. Van Buskirk, R. Gardiner, P. S. Kirlin and S. Krupanidhi: Proc. 8th Int. Symp. Applications Ferroelectric, Greenville, 1992 (IEEE, Piscataway, 1992) p. 340.
  7. M. Yoshida, H. Yamaguchi, T. Sakuma, Y. Miyasaka, P-Y. Lesaicherre and A. Ishitani: J. Electrochem. Soc. 142 (1995) 244.
  8. K. Kashihara, T. Okudaira, H. Itoh, T. Higaki and H. Abe: Ext. Abstr. 53rd Autumn Meet. Japan Society of Applied Physics, Suita, September, 1992, 16-p-ZV-13 [in Japanese].
  9. K. Kashihara, T. Okudaira, H. Itoh, T. Higaki and H. Abe: 1993 Symp. VLSI Tech. Dig. (1993) p. 49.
  10. M. Shimizu, M. Sugiyama, H. Fujisawa and T. Shiosaki: Jpn. J. Appl. Phys. 33 (1994) 5167[JSAP].
  11. S. Yamamichi, T. Sakuma, K .Takemura and Y. Miyasaka: Jpn. J. Appl. Phys. 30 (1991) 2193[JSAP].
  12. R. Waser and M. Klee: Proc. 3rd Int. Symp. Integrated Ferroelectrics (1991) p. 288.
  13. T. Kawahara, A. Yuuki and Y. Matsui: Jpn. J. Appl. Phys. 30 (1991) 431[JSAP].
  14. A. Yuuki, Y. Matsui and K. Tachibana: Jpn. J. Appl. Phys. 28 (1989) 212[JSAP].

|TOP|  |Next Article|  |Table of Contents| |JJAP Home|
Copyright © 2013 The Japan Society of Applied Physics
Contact Information