Jpn. J. Appl. Phys. 41 (2002) pp. L1164-L1166  |Next Article|  |Table of Contents|
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Letter

Effect of High-Pressure Oxygen Annealing on Bi2SiO5-Added Ferroelectric Thin Films

Takeshi Kijima1,2, Yoshihito Kawashima2, Yasushi Idemoto3 and Hiroshi Ishiwara2

1Research and Development for Future Electron Devices, 1-10-14 Kitaueno, Taito-ku 110-0014, Japan
2Tokyo Institute of Technology, 4259 Nagatsuta, Midori-ku, Yokohama 226-8503, Japan
3Science University of Tokyo, 2641 Yamazaki, Noda, Chiba 278-8510, Japan

(Received July 11, 2002; accepted for publication August 23, 2002)

The crystallization temperature of typical ferroelectric films such as PbZr1-XTiXO3 (PZT), SrBi2Ta2O9 (SBT), and (Bi,La)4Ti3O12 (BLT) was found to decrease by 150 to 200°C in a chemical solution deposition method by adding Bi2SiO5 (BSO) in the sol-gel solutions. It was also found that the ferroelectric and insulating characteristics of the BSO-added films were significantly improved by annealing in high-pressure oxygen up to 9.9 atms. Three-orders-of-magnitude improvement of the leakage current density was observed in BSO-added BLT films after annealing at 9.9 atms, while pronounced increase of the saturation polarization level was observed in BSO-added SBT and PZT films. From cross-sectional transmission electron microscopy (TEM) observations, the origin of the improved characteristics was speculated to be the structural change of the films.

URL: http://jjap.jsap.jp/link?JJAP/41/L1164/
DOI: 10.1143/JJAP.41.L1164


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