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Jpn. J. Appl. Phys. 43 (2004) pp. L365-L368  |Previous Article| |Next Article|  |Table of Contents|
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Letter

Effects of Grain Size and Abrasive Size of Polycrystalline Nano-particle Ceria Slurry on Shallow Trench Isolation Chemical Mechanical Polishing

Hyun-Goo Kang1,2,, Takeo Katoh1, Sung-Jun Kim1, Ungyu Paik2, Hyung-Soon Park3 and Jea-Gun Park1,

1Nano-SOI Process Laboratory, Hanyang University, 17 Haengdang-Dong, Seoungdong-Gu, Seoul 133-791, Korea
2Department of Ceramic Engineering, Hanyang University, 17 Haengdang-Dong, Seoungdong-Gu, Seoul 133-791, Korea
3Hynix Semiconductor Inc., San 136-1, Ami-ri, Bubal-eub, Icheon, Kyungki-do 467-701, Korea

(Received November 28, 2003; accepted January 13, 2004; published February 20, 2004)

In a ceria slurry with an ionic surfactant, the grain size and particle size of the poly-crystalline abrasives were controlled independently by changing the calcination temperature and the mechanical milling time, respectively, during abrasive synthesis. A chemical mechanical polishing (CMP) experiment using the slurry showed that the oxide removal rate increased with both the grain size and the abrasive particle size, while the nitride removal rate was independent of both. On the other hand, examination of the nanotopography impact showed that the planarization efficiency increased with decreasing abrasive size but was independent of the grain size.

URL: http://jjap.jsap.jp/link?JJAP/43/L365/
DOI: 10.1143/JJAP.43.L365
KEYWORDS:CMP, shallow trench isolation, ceria, oxide film, grain size, secondary particle size, surfactant, nanotopography


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