Jpn. J. Appl. Phys. 44 (2005) pp. 7424-7426  |Previous Article| |Next Article|  |Table of Contents|
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Brief Communication

Thermal Annealing Effect of Indium Tin Oxide Contact to GaN Light-Emitting Diodes

Chin-Yuan Hsu, Wen-How Lan1 and YewChung Sermon Wu

Department of Materials Science and Engineering, National Chiao Tung University, Hsinchu 300, Taiwan, R.O.C.
1Department of Electrical Engineering, National University of Kaohsiung, Kaohsiung 811, Taiwan, R.O.C.

(Received March 28, 2005; accepted May 11, 2005; published October 11, 2005)

We have fabricated GaN-based light-emitting diodes (LEDs) using transparent indium tin oxide (ITO) for p-type contacts. The current–voltage (IV) characteristics of the devices have been studied. When annealed at 700°C, the pn junction of the diodes became very leaky, and even electrical short circuits have been observed. According to scanning electron microscopy (SEM) and energy-dispersive X-ray spectrometer analyses (EDS), it was found that indium (In) diffused into the LED structure with defects such as threading dislocations (TDs) or V-pits. The defects provide leakage paths to cause short circuits in pn junctions at high annealing temperatures.

URL: http://jjap.jsap.jp/link?JJAP/44/7424/
DOI: 10.1143/JJAP.44.7424
KEYWORDS:GaN, LEDs, ITO contact, leakage, dislocation


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