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Jpn. J. Appl. Phys. 46 (2007) pp. L679-L681  |Previous Article|  |Table of Contents|
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Letter

Ultra-Water Repellency of Films Prepared by Capacitively Coupled C2H2F2/Ar Discharge Plasma

Yasunori Ohtsu, Nobuhisa Yamagami, and Hiroharu Fujita

Department of Electrical and Electronic Engineering, Saga University, Saga 840-8502, Japan

(Received December 29, 2006; revised May 25, 2007; accepted May 31, 2007; published online July 6, 2007)

Ultra-water-repellent films with a water contact angle of about 150° are prepared by chemical vapor deposition in a capacitively coupled C2H2F2–Ar discharge plasma. Scanning electron microscopy shows that the prepared films have an irregular rough microstructure in which particles of submicron diameter are complicatedly intertwined. Fourier-transform infrared spectroscopy indicates that the films include components of the C–H and C–F bonds, characterized by having a hydrophobic nature. It is found that the water contact angle of the films is almost independent of C2H2F2 concentration at a total pressure of 100 Pa, preserving the ultra-water repellency.

URL: http://jjap.jsap.jp/link?JJAP/46/L679/
DOI: 10.1143/JJAP.46.L679


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