Jpn. J. Appl. Phys. 47 (2008) pp. 879-884  |Previous Article| |Next Article|  |Table of Contents|
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Performance and Reliability Improvement of HfSiON Field-Effect Transistor with Low Hafnium Concentration Cap Layer Formed by Metal Organic Chemical Vapor Deposition with Diethylsilane

Motoyuki Sato, Yasushi Nakasaki1, Koji Watanabe2, Tomonori Aoyama, Eiji Hasegawa2, Masato Koyama1, Katsuyuki Sekine, Kazuhiro Eguchi, Masaki Saito3, and Yoshitaka Tsunashima

Process and Manufacturing Engineering Center, Semiconductor Company, Toshiba Corporation, 8 Shinsugita-cho, Isogo-ku, Yokohama 235-8522, Japan
1Corporate Research and Development Center, Toshiba Corporation, 8 Shinsugita-cho, Isogo-ku, Yokohama 235-8522, Japan
2NEC Electronics Corporation, 1120 Shimokuzawa, Sagaminara, Kanagawa 229-1198, Japan
3Sony Corporation, 4-14-1 Asahi-cho, Atsugi, Kanagawa 243-0014, Japan

(Received May 24, 2007; accepted November 19, 2007; published online February 15, 2008)

We have demonstrated stacked HfSiON gate dielectrics with a low-Hf-concentration [Hf/(Hf+Si)=6%] cap (LHC) layer. For fabricating the LHC layer, diethylsilane is more effective due to its decomposition characteristics being better than those of conventional amine-based precursors. The stacked structures exhibit improved mobility, the suppression of Vth shift, superior negative bias temperature instability (NBTI), and positive bias temperature instability (PBTI) reliability for complementary metal–oxide–semiconductor field-effect transistors (CMOSFETs), while maintaining low gate leakage currents. The mobility improvement is due to the superior control of nitrogen atoms, and the superior threshold voltage control and long-term reliability of the film are mainly due to the suppression of the positive oxygen vacancy (VO2+) formation related to carrier traps. These results were supported by the results of first-principles calculation.

URL: http://jjap.jsap.jp/link?JJAP/47/879/
DOI: 10.1143/JJAP.47.879
KEYWORDS:HfSiON, diethylsilane, PBTI, NBTI, oxygen vacancies


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References | Citing Article (1)

  1. G. D. Wilk, R. M. Wallace, and J. M. Anthony: J. Appl. Phys. 89 (2001) 5243[AIP Scitation].
  2. A. L. Rotondaro, M. R. Visokay, J. J. Chambers, A. Shanware, R. Khanmankar, H. Bu, R. T. Laaksonen, L. Tsung, M. Douglas, R. Kuan, M. J. Bejan, T. Grider, J. McPhreson, and L. Colombo: Symp. VLSI Technology Dig. Tech. Pap., 2002, p. 148.
  3. K. Sekine, S. Inumiya, M. Sato, A. Kaneko, K. Eguchi, and Y. Tsunashima: IEDM Tech. Dig., 2003, p. 103.
  4. M. Koyama, A. Kaneko, T. Ino, M. Koike, Y. Kamata, R. Iijima, Y. Kamimuta, A. Takashima, M. Suzuki, C. Hongo, S. Inumiya, M. Takayanagi, and A. Nishiyama: IEDM Tech. Dig., 2002, p. 849.
  5. H. N. Alshareef, H. R. Harris, H. C. Wen, C. S. Park, C. Huffman, K. Choi, H. F. Luan, P. Majhi, B. H. Lee, R. Jammy, D. J. Lichtenwalner, J. S. Jur, and A. I. Kingon: Symp. VLSI Technology Dig. Tech. Pap., 2006, p. 10.
  6. K. L. Lee, M. M. Frank, V. Paruchuri, E. Cartier, B. Linder, N. Bojarczuk, X. Wang, J. Rubino, M. Steen, P. Kozlowski, J. Newbury, E. Sikorski, P. Flaitz, M. Gribelyuk, P. Jamison, G. Singco, V. Narayanan, S. Zafar, S. Guha, P. Oldiges, R. Jammy, and M. Ieong: Symp. VLSI Technology Dig. Tech. Pap., 2006, p. 203.
  7. A. Kaneko, S. Inumiya, K. Sekine, M. Sato, Y. Kamimuta, K. Eguchi, and Y. Tsunashima: Ext. Abstr. Solid State Device and Materials, 2003, p. 742.
  8. R. Iijima, M. Takayanagi, T. Yamaguchi, M. Koyama, and A. Nishiyama: IEDM Tech. Dig., 2005, p. 433.
  9. C. Hobbs, L. Fonseca, V. Dhandapani, S. Samavedam, B. Taylor, J. Grant, L. Dip, D. Triyoso, R. Hegde, D. Gilmer, R. Garcia, D. Roan, L. Lovejoy, R. Rai, L. Hebert, H. Tseng, B. White, and P. Tobin: Symp. VLSI Technology Dig. Tech. Pap., 2003, p. 9.
  10. K. Shiraishi, K. Yamada, K. Torii, Y. Akasaka, K. Nakajima, M. Kohno, T. Chikyo, H. Kitajima, and T. Arikado: Symp. VLSI Technology Dig. Tech. Pap., 2004, p. 108.
  11. K. Torii, K. Shiraishi, S. Miyazaki, K. Yamabe, M. Boero, T. Chikyow, K. Yamada, H. Kitajima, and T. Arikado: IEDM Tech. Dig., 2004, p. 129.
  12. C. Shen, M. F. Li, X. P. Wang, H. Y. Yu, Y. P. Feng, A. T.-L. Lim, Y. C. Yeo, D. S. H. Chan, and D. L. Kwong: IEDM Tech. Dig., 2004, p. 733.

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