Jpn. J. Appl. Phys. 48 (2009) 06FC10 (5 pages)  |Previous Article| |Next Article|  |Table of Contents|
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Effect of Amine Additive in Photoacid Generator Bonded Resist for Extreme Ultraviolet and Electron Beam Lithography

Tomomi Nakahara1,3, Takeo Watanabe1,2, Hiroo Kinoshita1,2, Takayasu Mochizuki1,2, Yoshiyuki Takahara1,3, Yoshinobu Uozumi1,3, and Kouji Nakagawa1,3

1EUV Advanced Technologies Inc., 3-1-2 Koto, Kamigori, Hyogo 678-1205, Japan
2University of Hyogo, 3-1-2 Koto, Kamigori, Hyogo 678-1205, Japan
3Ako Kasei Co., Ltd., 329 Sakoshi, Ako, Hyogo 678-0193, Japan

(Received December 10, 2008; revised March 5, 2009; accepted March 12, 2009; published online June 22, 2009)

Amine additive compounds play an important role in obtaining high sensitivity and low line edge roughness (LER) in photoacid generator (PAG)-bonded resists. It was confirmed that the PAG-bonded resist improved sensitivity and LER simultaneously with an amine additive. High sensitivity and low LER can be achieved simultaneously by optimizing the amine compound ratio in a PAG-bonded resist system. By optimizing the contents of the PAG and the amine compound ratio, the resolution was improved up to 40 nm. The sensitivity and LER of a 40 nm line/space (L/S) pattern of the PAG-bonded resist were 26 µC/cm2 and 4.9 nm (3σ), respectively. Furthermore, by loading the PAG, a sensitivity of 16 µC/cm2 was achieved for a 60 nm L/S pattern. The E0 sensitivity was 1.75 mJ/cm2 under extreme ultraviolet (EUV) exposure. It was also confirmed that the PAG-bonded resist has high sensitivity under EUV exposure.

URL: http://jjap.jsap.jp/link?JJAP/48/06FC10/
DOI: 10.1143/JJAP.48.06FC10


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References

  1. H. Kinoshita, K. Kurihara, Y. Ishii, and Y. Torii: J. Vac. Sci. Technol. B 7 (1989) 1648[AIP Scitation].
  2. International Technology Roadmap for Semiconductors, 2007 edition [http://www.itrs.net/].
  3. H. Ito: IBM J. Res. Dev. 41 (1997) 69.
  4. H. Ito: J. Polym. Sci., Part A 41 (2003) 3863.
  5. H. Ito: Proc. SPIE 3678 (1999) 2[AIP Scitation].
  6. N. Man, T. Okumura, H. Oizumi, N. Nagai, H. Seki, and I. Nishiyama: Appl. Surf. Sci. 231 (2004) 353.
  7. H. Okumura: Proc. 15th Lecture Meet. Photo-reactions and Electric Materials, Society of Polymer and Science, 2006, p. 15.
  8. M. Thiyagarajan, K. Dean, and K. E. Gonsalves: J. Photopolym. Sci. Technol. 18 (2005) 737.
  9. T. Watanabe, Y. Fukushima, H. Shiotani, M. Hayakawa, S. Ogi, Y. Endo, T. Yamanaka, and H. Kinoshita: J. Photopolym. Sci. Technol. 19 (2006) 521.
  10. M. Shirai: Handotai Ekisho Display Photolithography Gijutsu Handbook (Handbook of Semiconductor and LCD Photolithography Technology) (Realize, Tokyo, 2006) p. 124 [in Japanese].
  11. C. Lee, N. D. Jarnagin, M. Wang, K. E. Gonsalves, J. M. Roberts, W. Yueh, and C. L. Henderson: Proc. SPIE 6153 (2006) 61532E[AIP Scitation].
  12. M. Wang, N. D. Jarnagin, W. Yueh, J. M. Robert, M. Tapia-Tapia, N. Batina, and K. E. Gonsalves: Proc. SPIE 6519 (2007) 65192C[AIP Scitation].
  13. Developed by P. Naulleau [http://www.euvl.com/summit].

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