Jpn. J. Appl. Phys. 48 (2009) 07GB04 (5 pages)  |Previous Article| |Next Article|  |Table of Contents|
|Full Text PDF (204K)| |Buy This Article|

Quantitative Evaluation of One-Dimensional Temperature Distribution on Material Surface Using Surface Acoustic Wave

Manabu Takahashi and Ikuo Ihara

(Received November 25, 2008; accepted February 17, 2009; published online July 21, 2009)

A quantitative method for measuring a one-dimensional temperature distribution on a material surface using a surface acoustic wave (SAW) is presented. The principle of the method is based on the temperature dependence of the velocity of the SAW propagating on a material surface. An effective method consisting of a SAW velocity measurement and an inverse analysis coupled with a one-dimensional finite difference calculation is developed to determine the surface temperature distribution quantitatively. To demonstrate the practical feasibility of the method, surface temperature distributions for aluminum and steel plates are examined. The SAW of each plate during heating is measured using a laser interferometer based on photorefractive two-wave mixing. The surface temperature distributions determined by the ultrasonic method almost agree with those measured using an infrared camera.

URL: http://jjap.jsap.jp/link?JJAP/48/07GB04/
DOI: 10.1143/JJAP.48.07GB04

References | Citing Articles (2)

1. T.-F. Chen, K.-T. Nguyen, S.-S. Wen, and C.-K. Jen: Meas. Sci. Technol. 10 (1999) 139.
2. K. Mizutani, A. Funakoshi, K. Nagai, and K. Harakawa: Jpn. J. Appl. Phys. 38 (1999) 3131[JSAP].
3. K. Balasubramainiam, V. V. Shah, R. D. Costley, G. Boudreaux, and J. P. Singh: Rev. Sci. Instrum. 70 (1999) 4618[AIP Scitation].
4. K. Ikeda: Jpn. J. Appl. Phys. 40 (2001) 3566[JSAP].
5. K. Kudo, K. Mizutani, T. Akagami, and R. Murayama: Jpn. J. Appl. Phys. 42 (2003) 3189[JSAP].
6. K. Kudo and K. Mizutani: Jpn. J. Appl. Phys. 43 (2004) 3095[JSAP].
7. W.-Y. Tsai, H.-C. Chen, and T.-L. Liao: Meas. Sci. Technol. 16 (2005) 548.
8. E. Ishikawa and K. Mizutani: Jpn. J. Appl. Phys. 42 (2003) 5372[JSAP].
9. N. Kashiwagura, M. Akita, and H. Kamioka: Jpn. J. Appl. Phys. 44 (2005) 4339[JSAP].
10. K. Mizutani, S. Kawabe, I. Saito, and H. Masuyama: Jpn. J. Appl. Phys. 45 (2006) 4516[JSAP].
11. A. Minamide, K. Mizutani, and N. Wakatsuki: Jpn. J. Appl. Phys. 47 (2008) 3967[JSAP].
12. H. Li, T. Ueki, and A. Yamada: Jpn. J. Appl. Phys. 47 (2008) 3940[JSAP].
13. M. Takahashi and I. Ihara: Jpn. J. Appl. Phys. 47 (2008) 3894[JSAP].
14. M. Takahashi and I. Ihara: Mod. Phys. Lett. B 22 (2008) 971.
15. S. Ito, M. Sugimoto, Y. Matsui, and J. Kondoh: Jpn. J. Appl. Phys. 46 (2007) 4718[JSAP].
16. K. Nishimura, N. Shigekawa, H. Yokoyama, and K. Hohkawa: Jpn. J. Appl. Phys. 44 (2005) L564[JSAP].
17. S. Wang, J. Harada, and S. Uda: Jpn. J. Appl. Phys. 42 (2003) 6124[JSAP].
18. B. F. Pouet, R. K. Ing, S. Krishnaswamy, and D. Royer: Appl. Phys. Lett. 69 (1996) 3782[AIP Scitation].
19. B. Pouet, S. Breugnot, and P. Clémenceau: AIP Conf. Proc. 820 (2006) 233.
20. G. E. Myers: Analytical Methods in Conduction Heat Transfer (McGraw-Hill, New York, 1971) p. 200.
21. J. L. Buchanan and P. R. Turner: Numerical Methods and Analysis (McGraw-Hill, New York, 1992) p. 422.
22. W. Press, S. Teukolsky, W. Vetterling, and B. Flannery: Numerical Recipes in C++ (Cambridge University Press, New York, 2003) p. 847.