Jpn. J. Appl. Phys. 49 (2010) 071501 (5 pages)  |Previous Article| |Next Article|  |Table of Contents|
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Fabrication of Nonsintered Alumina–Resin Hybrid Films by Inkjet-Printing Technology

Hun Woo Jang, Jihoon Kim, Hyo-tae Kim, Youngjoon Yoon, Sung-nam Lee1, Haejin Hwang2, and Jonghee Kim

Future Convergence Ceramic Division, Korea Institute of Ceramic Engineering and Technology, Seoul 153-801, Korea
1Department of Nano-Optical Engineering, Korea Polytechnic University, Siheung, Gyeonggi 429-793, Korea
2Department of Ceramics, Inha University, Incheon 402-759, Korea

(Received November 16, 2009; accepted March 12, 2010; published online July 20, 2010)

We used the inkjet printing to fabricate alumina–resin hybrid films without a high temperature sintering process. Single- and co-solvent ink systems showing different evaporation behaviors were formulated in order to understand their impacts on the inkjet-printing of the alumina dots, lines, and films. The packing densities of the inkjet-printed alumina films from both ink systems were around 60% which is higher than the value obtained by other conventional methods. Since the high temperature sintering process was avoided, the polymer–resin was infiltrated through the inkjet-printed alumina films by the same inkjet printing as a binder. The microstructures of these hybrid films were investigated in order to confirm if the microvoids in the films were filled with the resin. The dielectric properties of these hybrid films such as relative permittivity and Q-value were measured in order to assess if these hybrid materials is applicable to three-dimensional (3D) system integration as ceramic package substrates.

URL: http://jjap.jsap.jp/link?JJAP/49/071501/
DOI: 10.1143/JJAP.49.071501


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References | Citing Articles (4)

  1. J. Miettinen, V. Pekkanen, K. Kaija, P. Manasikkamaki, J. Mantysalo, M. Mantysalo, J. Niittynen, J. Pekkanen, T. Saviauk, and R. Ronkka: Microelectron. J. 39 (2008) 1740.
  2. N. R. Bieri, J. Chung, S. E. Haferi, D. Poulikakos, and C. P. Grigoropoulos: Appl. Phys. Lett. 82 (2003) 3529[AIP Scitation].
  3. R. A. Street, W. S. Wong, S. E. Ready, M. L. Chabinyc, A. C. Arias, S. Limb, A. Salleo, and R. Lujan: Mater. Today 9 (2006) No. 4, 32.
  4. Y. Imanaka: Multilayered Low Temperature Cofired Ceramics (LTCC) Technology (Springer, New York, 2003) p. 4.
  5. R. D. Deegan, O. Bakajin, T. F. Dupont, G. Huber, S. R. Nagel, and T. A. Witten: Nature 389 (1997) 827[CrossRef].
  6. R. D. Deegan, O. Bakajin, T. F. Dupont, G. Huber, S. R. Nagel, and T. A. Witten: Phys. Rev. E 62 (2000) 756[APS].
  7. F. Girard, M. Antoni, S. Faure, and A. Steinchen: Langmur 22 (2006) 11085.
  8. H. Hu and R. G. Larson: Langmur 21 (2005) 3972.
  9. J. Park and J. Moon: Langmur 22 (2006) 3506.
  10. D. Fujimoto, Y. Mizuno, N. Takano, S. Sase, H. Negishi, and T. Sugimura: Proc. IEEE Polytronics Conf., 2002, p. 114.

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