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Resin Elongation Phenomenon of Polystyrene Nanopillars in Nanoimprint Lithography
Kosuke Kuwabara1,2,
Akihiro Miyauchi1, and
Hiroyuki Sugimura2
1Materials Research Laboratory, Hitachi, Ltd., 7-1-1 Omika, Hitachi, Ibaraki 319-1292, Japan
2Department of Materials Science and Engineering, Kyoto University, Yoshida-Hon'machi, Sakyo, Kyoto 606-8501, Japan
(Received May 14, 2010; accepted July 17, 2010; published online October 20, 2010)
We investigated the elongation of polystyrene nanopillars formed by thermal nanoimprint lithography. Silicone and perfluoropolyether were used as mold release agents to obtain molds with different adhesion forces against polystyrene to be imprinted. The adhesion force between the resin and release layers was evaluated as a force curve by atomic force microscope with a polystyrene colloid probe. Elongation depended on the aspect ratio of the corresponding microholes on the mold and the adhesion force against the release layer. The conditions under which the elongation occurred exhibited a clear threshold on the stress loaded on the foot area of the nanopillars.
URL:
http://jjap.jsap.jp/link?JJAP/49/106505/
DOI: 10.1143/JJAP.49.106505
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