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Jpn. J. Appl. Phys. 50 (2011) 010104 (4 pages)  |Previous Article| |Next Article|  |Table of Contents|
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Selected Topics in Applied Physics

Technology Evolution for Silicon Nano-Electronics

Counter-Electrode-Free Thin Cu Film Deposition Based on Ballistic Electron Injection into CuSO₄ Solution from Nanosilicon Emitter

Toshiyuki Ohta, Bernard Gelloz, and Nobuyoshi Koshida

Graduate School of Engineering, Tokyo University of Agriculture and Technology, 2-24-16 Nakacho, Koganei, Tokyo 184-8588, Japan

(Received July 30, 2010; accepted October 11, 2010; published online January 20, 2011)

It is shown that a nanocrystalline silicon (nc-Si) ballistic electron emitter acts as an active electrode in a metal–salt solution (such as CuSO₄ solution). The nc-Si emitter is composed of a thin Au film (10 nm thick), anodized polycrystalline layer (1 µm thick), and single-crystalline n⁺-Si substrate. In accordance with the results of an analysis by cyclic-voltammogram measurements under the standard three-electrode configuration, the electron injection effect into the solution is clearly observed at a potential within the electrochemical window where no electrolytic reactions appear. When the nc-Si emitter is driven alone in a CuSO₄ solution without using any counter electrodes, a polycrystalline thin Cu film is uniformly formed on the emitting surface. This is presumably due to the preferential reduction of Cu²⁺ ions at the interface by injected energetic electrons. The observed deposition mode is different from both the conventional electroplating and electroless plating. This technique is an alternative low-temperature wet process that will be applicable to the deposition of various thin metal films.

URL: http://jjap.jsap.jp/link?JJAP/50/010104/
DOI: 10.1143/JJAP.50.010104
PACS: 81.15.Jj, 68.35.bd, 82.45.Yz, 68.55.at

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