Jpn. J. Appl. Phys. 50 (2011) 06GE09 (4 pages)  |Previous Article| |Next Article|  |Table of Contents|
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Thermal Dissipation of High-Brightness Light Emitting Diode by Using Multiwalled Carbon Nanotube/SiC Composites

Bing-Jing Li, Chih-Hsiang Chang, Yun-Kuin Su, and Kwang-Jow Gan¹

(Received December 1, 2010; revised February 14, 2011; accepted February 16, 2011; published online June 20, 2011)

To improve the thermal conductance of epoxy used in the high-brightness light emitting diode (HB-LED) package, varied types of fillers were investigated. These fillers included non-functionalized multiwalled carbon nanotubes (MWCNTs), functionalized MWCNTs, micro-SiC particles and the composite of functionalized MWCNTs and micro-SiC particles. Forward voltages at test conditions, junction temperatures, luminous fluxes and operation current–forward voltage (I–V) relation of HB-LEDs were measured or determined for varied combination and contents of fillers in the epoxy. The experimental results showed the epoxy with the composite of 30 wt % of SiC and 5 wt % of MWCNTs had the best thermal properties. Comparing to commercial epoxy, under the operation of injection current of 350 mA, the MWCNT/SiC/epoxy could decrease junction temperature from 123 to 93 °C and thermal resistance from 81 to 65 °C/W.

URL: http://jjap.jsap.jp/link?JJAP/50/06GE09/
DOI: 10.1143/JJAP.50.06GE09
PACS: 85.60.Jb, 81.07.De, 66.70.Lm, 85.60.Bt, 81.05.Lg, 81.05.Hd

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