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Jpn. J. Appl. Phys. 51 (2012) 027302 (8 pages)  |Previous Article| |Next Article|  |Table of Contents|
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Increased Interfacial Strength at Microscale Silicon–Polymer Interface by Nanowires Assisted Micro-Sandglass Shaped Interlocks

Hsien-Chih Peng1, Hwa Seng Khoo2, and Fan-Gang Tseng1,3

1Department of Engineering and System Science, National Tsing Hua University, Hsinchu, Taiwan 30013, R.O.C.
2Institut de Science et d'Ingénierie Supramoléculaires (ISIS), Université de Strasbourg, CNRS UMR 7006, No. 8, allée Gaspard Monge, 67083 Strasbourg Cedex, France
3Division of Mechanics, Research Center for Applied Sciences, Academia Sinica, Taipei, Taiwan 11529, R.O.C.

(Received May 19, 2011; accepted December 6, 2011; published online February 6, 2012)

We present an interfacial strengthening technique for microsystem packaging, particularly at the interface of stiff and soft materials. Micro-sandglass shaped interlocks (MSIs) were first demonstrated at the interface of silicon and Nafion® and exhibited a strong interfacial strength of 1 MPa; moreover, nanowired micro-sandglass shaped interlocks (NW-MSIs) were employed to further enhance the interfacial strength, and a value of 3.4 MPa was achieved. Theoretical predictions indicated the enhancement factors include the gap shrinkage ratio, overhanging angle, contact area, and friction coefficient. The geometry of the MSIs is strongly dependent on the KOH etching time while the friction can be enhanced by the employment of nanowires on the sidewalls of MSIs. Based on the NW-MSIs, the highest interfacial strength obtained is 3.4-fold higher than that of MSIs without nanowires.

URL: http://jjap.jsap.jp/link?JJAP/51/027302/
DOI: 10.1143/JJAP.51.027302


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References | Citing Article (1)

  1. S. H. Huang, H. S. Khoo, S. Y. ChangChien, and F. G. Tseng: Microfluid. Nanofluid. 5 (2008) 459.
  2. K. H. Lee, Y. D. Su, S. J. Chen, F. G. Tseng, and G. B. Lee: Biosens. Bioelectron. 23 (2007) 466.
  3. Y. H. Seo and Y. H. Cho: Sens. Actuators A 150 (2009) 87.
  4. J. Yeom, G. Z. Mozsgai, B. R. Flachsbart, E. R. Choban, A. Asthana, M. A. Shannon, and P. J. A. Kenis: Sens. Actuators B 107 (2005) 882.
  5. Y. Zhang, J. Lu, S. Shimano, H. Zhou, and R. Maeda: Electrochem. Commun. 9 (2007) 1365.
  6. J. C. McDonald, D. C. Duffy, J. R. Anderson, D. T. Chiu, H. Wu, O. J. A. Schueller, and G. M. Whitesides: Electrophoresis 21 (2000) 27.
  7. S. Y. Kook, J. M. Snodgrass, A. Kirtikar, and R. H. Dauskardt: J. Electron. Packag. 120 (1998) 328.
  8. R. W. Messler, Jr. and S. Genc: J. Thermoplast. Compos. Mater. 11 (1998) 200.
  9. M. Liger, D. C. Rodger, and Y.-C. Tai: Proc. 16th IEEE Micro Electro Mechanical Systems (MEMS), 2003, p. 602.
  10. M. P. Larsson, R. R. A. Syms, and A. G. Wojcik: J. Micromech. Microeng. 15 (2005) 2074.
  11. M. P. Larsson and M. M. Ahmad: J. Micromech. Microeng. 16 (2006) S161.
  12. C. M. Lin, W. C. Chen, and W. Fang: J. Micromech. Microeng. 17 (2007) 2461.
  13. W. R. Chang, J. J. Hwang, F. B. Weng, and S. H. Chan: J. Power Sources 166 (2007) 149.
  14. M. Shikida, T. Hasada, and K. Sato: J. Micromech. Microeng. 16 (2006) 2230.
  15. C.-Y. Chen, C.-S. Wu, C.-J. Chou, and T.-J. Yen: Adv. Mater. 20 (2008) 3811[CrossRef].
  16. M. Shikida, K.-I. Nanbara, T. Koizumi, H. Sasaki, M. Odagaki, K. Sato, M. Ando, S. Furuta, and K. Asaumi: Sens. Actuators A 97–98 (2002) 758.
  17. I. T. Kim, J. Choi, and S. C. Kim: J. Membrane Sci. 300 (2007) 28.
  18. G. Y. Lee, K. Cheung, W. Chang, and L. P. Lee: Proc. 1st Annu. Int. IEEE-EMBS Conf., 2000, p. 1.
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