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Characteristics of Hot Hole Injection, Trapping, and Detrapping in Gate Oxide of Polycrystalline Silicon Thin-Film Transistors

Yoshinari Kamakura1,2, Takashi Himukashi1, Hiroshi Tsuji1, and Kenji Taniguchi1

1Division of Electrical, Electronic and Information Engineering, Osaka University, Suita, Osaka 565-0871, Japan
2Japan Science and Technology Agency (JST), CREST, Kawaguchi, Saitama 332-0012, Japan

(Received September 26, 2011; accepted November 22, 2011; published online February 20, 2012)

The characterization and modeling of the hysteresis phenomenon observed in the off-state regime of n-channel polycrystalline thin-film transistors are presented. The shift in IdVg characteristics between upward and downward scan were measured under various bias conditions and ambient temperatures. The localized positive charge build-up induced by band-to-band hot hole injection is responsible for the mechanism for reducing the off-leakage current, and it is recovered through the thermal emission of trapped holes, which is enhanced by self-heating of the device during the on-current conduction. On the basis of this model, the internal device characteristics related to the thermal and oxide trap properties are analyzed.

URL: http://jjap.jsap.jp/link?JJAP/51/02BC05/
DOI: 10.1143/JJAP.51.02BC05


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