Jpn. J. Appl. Phys. 51 (2012) 04DB08 (10 pages)  |Previous Article| |Next Article|  |Table of Contents|
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Board-Level Solder Joint Reliability of Edge- and Corner-Bonded Lead-Free Chip Scale Package Assemblies Subjected to Thermal Cycling

Hongbin Shi, Cuihua Tian, and Toshitsugu Ueda

(Received September 27, 2011; accepted January 24, 2012; published online April 20, 2012)

In this paper, we present the results of thermal cycling test for edge- and corner-bonded lead-free chip scale packages (CSPs), which was carried out on the basis of the IPC-9701 test standard. Six materials were used in this study: four edge-bond adhesives and two corner-bond adhesives. These adhesives were compared with CSPs with full capillary flow underfill (FCFU) and without adhesives. The thermal cycling test results show that corner-bond adhesive has comparable solder joint reliability performance with CSP without adhesive, and is better than edge-bond adhesive, followed by CSPs with FCFU. In addition, the adhesives with a low coefficient of thermal expansion, a high glass transition temperature and a intermediate storage modulus yielded good performance. Results of detailed failure analysis indicate that the dominant failure mode is solder bulk fatigue cracking near package and/or printed circuit board (PCB) pads, and that the location of critical solder joints change from die edges to package corners with the introduction of adhesives.

URL: http://jjap.jsap.jp/link?JJAP/51/04DB08/
DOI: 10.1143/JJAP.51.04DB08

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