Jpn. J. Appl. Phys. 51 (2012) 04DC02 (6 pages)  |Previous Article| |Next Article|  |Table of Contents|
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Recovery Characteristics of Anomalous Stress-Induced Leakage Current of 5.6 nm Oxide Films

Takuya Inatsuka1, Yuki Kumagai1, Rihito Kuroda1, Akinobu Teramoto2, Shigetoshi Sugawa1,2, and Tadahiro Ohmi2

1Graduate School of Engineering, Tohoku University, Sendai 980-8579, Japan
2New Industry Creation Hatchery Center, Tohoku University, Sendai 980-8579, Japan

(Received September 25, 2011; accepted December 16, 2011; published online April 20, 2012)

Anomalous stress-induced leakage current (SILC), which has a much larger current density than average SILC, causes severe bit error in flash memories. To suppress anomalous SILC, detailed evaluations are strongly required. We evaluate the characteristics of anomalous SILC of 5.6 nm oxide films using a fabricated array test pattern, and recovery characteristics are observed. Some characteristics of typical anomalous cells in the time domain are measured, and the recovery characteristics of average and anomalous SILCs are examined. Some of the anomalous cells have random telegraph signals (RTSs) of gate leakage current, which are characterized as discrete and random switching phenomena. The dependence of RTSs on the applied electric field is investigated, and the recovery tendency of anomalous SILC with and without RTSs are also discussed.

URL: http://jjap.jsap.jp/link?JJAP/51/04DC02/
DOI: 10.1143/JJAP.51.04DC02


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