Jpn. J. Appl. Phys. 51 (2012) 04DD10 (6 pages) |Previous Article| |Next Article| |Table of Contents|
|Full Text PDF (1072K)| |Buy This Article|
Excellent Uniformity and Multilevel Operation in Formation-Free Low Power Resistive Switching Memory Using IrOx/AlOx/W Cross-Point
Writam Banerjee,
Sk. Ziaur Rahaman, and
Siddheswar Maikap
Thin Film Nano Technology Laboratory, Department of Electronic Engineering, Chang Gung University, Kweishan, Taoyuan 333, Taiwan
(Received September 26, 2011; accepted December 12, 2011; published online April 20, 2012)
Excellent uniformity and multilevel operation in formation-free low-power resistive switching memory fabricated using the IrOx/AlOx/W cross-point structure have been investigated. The thickness of the deposited films has been measured by high-resolution transmission electron microscopy with energy dispersive X-ray spectroscopy for each layer. The cross-point resistive switching memory devices have a tight distribution of SET/RESET voltages and low/high-resistance states as well as switching cycles. A high resistance ratio of >8×102 is obtained. This memory device shows excellent AC endurance of >5×103 cycles, read endurance of >1×105 cycles, and 10-year-data retention at 85 °C at a low power of 55 µW and low-current compliances of 50–200 µA. This study is not only important for cross-point memories but will also help in the design of high-density nanoscale nonvolatile memories in the future.
URL:
http://jjap.jsap.jp/link?JJAP/51/04DD10/
DOI: 10.1143/JJAP.51.04DD10
References
- A. Sawa: Mater. Today 11 [6] (2008) 28.
- K. Yohwan: Proc. IEEE Int. Memory Workshop, 2009, p. 1.
- R. Waser and M. Aono:
Nat. Mater. 6 (2007) 833[CrossRef].
- S. Asanuma, H. Akoh, H. Yamada, and A. Sawa:
Phys. Rev. B 80 (2009) 235113[APS].
- R. Waser, R. Dittmann, G. Staikov, and K. Szot:
Adv. Mater. 21 (2009) 2632[CrossRef].
- A. Nayak, T. Tsuruoka, K. Terabe, T. Hasegawa, and M. Aono:
Nanotechnology 22 (2011) 235201[IoP STACKS].
- S. Z. Rahaman, S. Maikap, H.-C. Chiu, C.-H. Lin, T.-Y. Wu, Y.-S. Chen, P.-J. Tzeng, F. Chen, M.-J. Kao, and M.-J. Tsai: Electrochem. Solid-State Lett. 13 (2010) H159.
- S. Yu and H.-S. P. Wong:
IEEE Trans. Electron Devices 58 (2011) 1352[CrossRef].
- D. Panda, A. Dhar, and S. K. Ray:
J. Appl. Phys. 108 (2010) 104513[AIP Scitation].
- A. Prakash, S. Maikap, C. S. Lai, H. Y. Lee, W. S. Chen, F. T. Chen, M.-J. Kao, and M.-J. Tsai: Ext. Abstr. Int. Conf. Solid State Devices and Materials, 2011, p. 999.
- I. G. Baek, M. S. Lee, S. Seo, M. J. Lee, D. H. Seo, D. S. Suh, J. C. Park, S. O. Park, H. S. Kim, I. K. Yoo, U. I. Chung, and J. T. Moon: IEDM Tech. Dig., 2004, p. 587.
- D. Ielmini, F. Nardi, C. Cagli, and A. L. Lacaita:
IEEE Electron Device Lett. 31 (2010) 353[CrossRef].
- H. Y. Lee, P. S. Chen, C. C. Wang, S. Maikap, P. J. Tzeng, C. H. Lin, L. S. Lee, and M.-J. Tsai:
Jpn. J. Appl. Phys. 44 (2005) L345[JSAP].
- H. Y. Lee, Y. S. Chen, P. S. Chen, T. Y. Wu, F. Chen, C. C. Wang, P. J. Tzeng, M.-J. Tsai, and C. Lien:
IEEE Electron Device Lett. 31 (2010) 44[CrossRef].
- P. S. Chen, H. Y. Lee, Y. S. Chen, F. Chen, and M.-J. Tsai:
Jpn. J. Appl. Phys. 49 (2010) 04DD18[JSAP].
- K. M. Kim, B. J. Choi, B. W. Koo, S. Choi, D. S. Jeong, and C. S. Hwang: Electrochem. Solid-State Lett. 9 (2006) G343.
- C.-Y. Lin, C.-Y. Wu, C.-Y. Wu, C. Hu, and T.-Y. Tseng: J. Electrochem. Soc. 154 (2007) G189.
- C.-Y. Lin, D.-Y. Lee, S.-Y. Wang, C.-C. Lin, and T.-Y. Tseng: Surf. Coatings Technol. 203 (2008) 628.
- W. Zhu, T. P. Chen, Z. Liu, M. Yang, Y. Liu, and S. Fung:
J. Appl. Phys. 106 (2009) 093706[AIP Scitation].
- J. Song, A. I. Inamdar, B. U. Jang, K. Jeon, Y. S. Kim, K. Jung, Y. Kim, H. Im, W. Jung, H. Kim, and J. P. Hong:
Appl. Phys. Express 3 (2010) 091101[JSAP].
- Y. Wu, B. Lee, and H.-S. Philip Wong:
IEEE Electron Device Lett. 31 (2010) 1449[CrossRef].
- W. Banerjee, S. Z. Rahaman, A. Prakash, and S. Maikap:
Jpn. J. Appl. Phys. 50 (2011) 10PH01[JSAP].
- Y. S. Chen, H. Y. Lee, P. S. Chen, T. Y. Wu, C. C. Wang, P. J. Tzeng, F. Chen, M.-J. Tsai, and C. H. Lien:
IEEE Electron Device Lett. 31 (2010) 1473[CrossRef].
- J. Liang and H.-S. P. Wong:
IEEE Trans. Electron Devices 57 (2010) 2531[CrossRef].
- C. W. Hsu, J. J. Huang, Y. M. Tseng, T. H. Hou, W. H. Chang, W. Y. Jang, and C. H. Lin: Ext. Abstr. Int. Conf. Solid State Devices and Materials, 2011, p. 1015.
- I. G. Baek, D. C. Kim, M. J. Lee, H.-J. Kim, E. K. Yim, M. S. Lee, J. E. Lee, S. E. Ahn, S. Seo, J. H. Lee, J. C. Park, Y. K. Cha, S. O. Park, H. S. Kim, I. K. Yoo, U.-I. Chung, J. T. Moon, and B. I. Ryu: IEDM Tech. Dig., 2005, p. 750.
- D. Lee, J. Park, S. Jung, G. Choi, J. Lee, M. Siddik, J. Shin, S. Kim, J. Woo, and H. Hwang: Ext. Abstr. Int. Conf. Solid State Devices and Materials, 2011, p. 1015.
- J. Lee, M. Jo, D.-J. Seong, J. Shin, and H. Hwang: Microelectron. Eng. 88 (2011) 1113.
- B. Govoreanu, S. Kubicek, G. Kar, Y.-Y. Chen, V. Paraschiv, M. Rakowski, R. Degraeve, L. Goux, S. Clima, N. Jossart, C. Adelmann, O. Richard, T. Raes, D. Vangoidsenhoven, T. Vandeweyer, H. Tielens, K. Kellens, K. Devriendt, N. Heylen, S. Brus, B. Verbrugge, L. Pantisano, H. Bender, G. Pourtois, J. A. Kittl, D. J. Wouters, L. Altimime, and M. Jurczak: Ext. Abstr. Int. Conf. Solid State Devices and Materials, 2011, p. 1005.
- D. S. Jeong, B.-K. Cheong, and H. Kohlstedt:
Solid-State Electron. 63 (2011) 1[CrossRef].
- X. G. Wang, Y. S. Jang, N. H. Yang, L. Yuan, and S. J. Pang: Surf. Coatings Technol. 99 (1998) 82.
- S. Maikap, A. Das, T. Y. Wang, T. C. Tien, and L. B. Chang: J. Electrochem. Soc. 156 (2009) K28.
- W. Banerjee, S. Maikap, T.-C. Tien, W.-C. Li, and J.-R. Yang:
J. Appl. Phys. 110 (2011) 074309[AIP Scitation].