Jpn. J. Appl. Phys. 51 (2012) 04DE01 (4 pages)  |Previous Article| |Next Article|  |Table of Contents|
|Full Text PDF (494K)| |Buy This Article|

Manipulation of Dispersed Magnetic Beads for On-Chip Immunoassay

Tomohiro Ishikawa^1,2, Jaesung Lee¹, and Ryo Miyake^1,2

(Received September 27, 2011; revised November 29, 2011; accepted December 15, 2011; published online April 20, 2012)

To provide a simple and low-cost mobile immunoassay platform, a test chip on which dispersed magnetic beads are manipulated was designed and fabricated by a 180 nm standard complementary metal–oxide–semiconductor (CMOS) process. In preliminary experiments, beads that have a diameter of 2.8 µm were successfully manipulated and their motion were captured and analyzed. Then, an immunoassay was conducted on the chip. First, the nonspecific binding of hydrophilic beads coated with an antibody was compared with that of hydrophobic beads that were used for the preliminary experiments. Next, comparison of an immunoassay of mouse IgG with a control assay and a test on the feasibility of the blocking process were conducted simultaneously. The beads coated with the antibody were successfully immobilized onto the chip surface in the presence of the target antigen, which was checked through bead manipulation. This indicates that an immunoassay on an inexpensive CMOS chip is feasible using an affordable amount of driving current.

URL: http://jjap.jsap.jp/link?JJAP/51/04DE01/
DOI: 10.1143/JJAP.51.04DE01

References

1. For example, see B. Alberts, A. Johnson, J. Lewis, M. Raff, K. Roberts, and P. Walter: Molecular Biology of the Cell (Garland Science, New York, 2008) 5th ed., p. 588.
2. R. Kotitz, H. Matz, L. Trahms, H. Koch, W. Weitschies, T. Rheinlander, W. Semmler, and T. Bunte: IEEE Trans. Appl. Supercond. 7 (1997) 3678[CrossRef].
3. D. R. Baselt, G. U. Lee, M. Natesan, S. W. Metzger, P. E. Sheehan, and R. J. Colton: Biosens. Bioelectron. 13 (1998) 731.
4. M. A. M. Gijs: Microfluid. Nanofluid. 1 (2004) 22.
5. T.-S. Aytur, M. Anwar, T. Ishikawa, P. R. Beatty, and B. E. Boser: Hilton Head Workshop Tech. Dig., 2002, p. 126.
6. T. Huai-Yuan and V. Subramanian: Device Research Conf., 2009, p. 185.
7. H. Kempa, M. Hambsch, K. Reuter, M. Stanel, G. C. Schmidt, and A. C. Hubler: IEEE Trans. Electron Devices 58 (2011) 2765[CrossRef].
8. U. Zschieschang, N. H. Hansen, J. Pflaum, T. Yamamoto, K. Takimiya, H. Kawabata, M. Ikeda, T. Sekitani, T. Someya, and H. Klauk: Device Research Conf., 2011, p. 57.
9. K. Suemori, S. Uenuma, M. Yoshida, S. Hoshino, N. Takada, T. Kodzasa, and T. Kamata: Appl. Phys. Lett. 91 (2007) 192112[AIP Scitation].
10. T. Ishikawa, F. Kaneko, and K. Johguchi: Jpn. J. Appl. Phys. 49 (2010) 04DL08[JSAP].
11. T. Ishikawa, J.-S. Lee, and R. Miyake: Proc. 2011 28th Sensor Symp. Sensors, Micromachines and Applied Systems, p. 684 [in Japanese].
12. T. Ishikawa, J.-S. Lee, and R. Miyake: submitted to Denki Gakkai Ronbunshi E [in Japanese].
13. T. Ishikawa, J.-S. Lee, and R. Miyake: to be published in Proc. 2011 Int. Conf. Miniaturized Systems for Chemistry and Life Science.