Jpn. J. Appl. Phys. 51 (2012) 05EA06 (5 pages)  |Previous Article| |Next Article|  |Table of Contents|
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Oxidation Characteristics of Thin Al–Mo Alloy Films with Various Compositions as Metal Capping Layer on Cu

Mayumi B. Takeyama and Atsushi Noya

Department of Electrical and Electronic Engineering, Faculty of Engineering, Kitami Institute of Technology, Kitami, Hokkaido 090-8507, Japan

(Received October 14, 2011; accepted November 28, 2011; published online May 21, 2012)

The oxidation characteristics of Al–Mo alloy films (50 nm) deposited on Cu as a metal capping layer have been examined by varying the alloy composition. Cu oxidation from the surface and Cu out-diffusion toward the surface are well suppressed when using Al–Mo alloy with a Mo-rich composition. By using an Al15Mo85 alloy film, in which fine crystalline grains of AlMo3 are dispersed in an amorphous phase of the alloy, a well-separated layer configuration of oxide/Al–Mo alloy/Cu without excess Cu diffusion and/or preferential Al oxidation in the alloy layer is realized upon oxidation at 350 °C for 1 h in air. It is revealed that Al15Mo85 alloy films are a useful candidate material of a metal capping layer for Cu interconnects.

URL: http://jjap.jsap.jp/link?JJAP/51/05EA06/
DOI: 10.1143/JJAP.51.05EA06


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