Jpn. J. Appl. Phys. 51 (2012) 05EF04 (2 pages)  |Previous Article| |Next Article|  |Table of Contents|
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Brief Note

Spatial Fourier Transform Analysis of Polishing Pad Surface Topography

Panart Khajornrungruang, Keiichi Kimura, Takahisa Okuzono, Keisuke Suzuki, and Takashi Kushida

(Received October 17, 2011; accepted February 8, 2012; published online May 21, 2012)

The spatial Fourier transform analysis is proposed to quantitatively evaluate the irregular topography of the conditioned chemical mechanical polishing (CMP) pad surface. We discuss the power spectrum in the spatial wavelengths of the surface topographies corresponding to polishing time. We conclude that the spatial wavelength of less than 5 µm in the topography yielded high material removal rates.

URL: http://jjap.jsap.jp/link?JJAP/51/05EF04/
DOI: 10.1143/JJAP.51.05EF04

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