Jpn. J. Appl. Phys. 51 (2012) 05EF04 (2 pages) |Previous Article| |Next Article| |Table of Contents|
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Spatial Fourier Transform Analysis of Polishing Pad Surface Topography
Faculty of Computer Science and Systems Engineering, Kyushu Institute of Technology, Iizuka, Fukuoka 820-8502, Japan
(Received October 17, 2011; accepted February 8, 2012; published online May 21, 2012)
The spatial Fourier transform analysis is proposed to quantitatively evaluate the irregular topography of the conditioned chemical mechanical polishing (CMP) pad surface. We discuss the power spectrum in the spatial wavelengths of the surface topographies corresponding to polishing time. We conclude that the spatial wavelength of less than 5 µm in the topography yielded high material removal rates.
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