Quick Search: Journal  Author  Title/Abstract  Vol./Year 

Jpn. J. Appl. Phys. 51 (2012) 06FD04 (5 pages)  |Previous Article| |Next Article|  |Table of Contents|
|Full Text PDF: FREE (797K)|

Three-Dimensional Force Sensing Device Using Carbon Nanofiber Polymer Composites: Design and Fabrication

Fuh-Yu Chang, Chia-Ming Liu1, Tse-Min Chen, Chia-Ming Chen, Yu-Hsien Lin, and Shu-Jiuan Huang2

Department of Mechanical Engineering, National Taiwan University of Science and Technology, Taipei 10607, Taiwan
1Nanotechnology Research Center, Industrial Technology Research Institute, Hsinchu 31040, Taiwan
2Material and Chemical Lab, Industrial Technology Research Institute, Hsinchu 31040, Taiwan

(Received November 30, 2011; accepted February 1, 2012; published online June 20, 2012)

We propose an innovative three-dimensional force sensing device fabricated with carbon nanofiber (CNF) polymer composites. The device has four piezoresistive strain sensors made onto a polyimide substrate using surface patterning treatment and tilted-drop process with CNF polymer solutions. The proposed design and fabrication process is simpler than that of other three-dimensional force sensors and the device is suitable for mass production. The fabricated strain sensor properties using CNF polymer solutions with different composition ratios were investigated. An equation was derived using simple percolation theory to predict the conductivity of CNF polymer composites. The measured gauge factors were in the 4.84 to 17.68 range for CNF polymer composites with CNF 8.85–45.2 wt %. A programmable system on chip (PSoC) with built-in operational (OP) amplifier, analog-to-digital (AD) converter and multiplexer was used to develop a scanning and analyzing circuit for the three-dimensional force sensing device. The proposed integrated system was successfully applied to control a computer screen cursor.

URL: http://jjap.jsap.jp/link?JJAP/51/06FD04/
DOI: 10.1143/JJAP.51.06FD04


|Full Text PDF: FREE (797K)|  Citation:

References

  1. L. Beccai, S. Roccella, A. Arena, F. Valvo, P. Valdastri, A. Menciassi, M. C. Carrozza, and P. Dario: Sens. Actuators A 120 (2005) 370.
  2. S. Rues, B. Panchaphongsaphak, P. Gieschke, O. Paul, and B. G. Lapatki: J. Biomech. 44 (2011) 1892.
  3. Z. Chi and K. Shida: Sens. Actuators A 111 (2004) 172.
  4. G. Songa, H. Yuan, Y. Tang, Q. Songd, and Y. Ged: Sens. Actuators A 128 (2006) 60.
  5. P. B. Shull and R. V. Gonzalez: J. Neurosci. Meth. 151 (2006) 194.
  6. T. Mukai, M. Onishi, T. Odashima, S. Hirano, and Z. Luo: IEEE Trans. Robotics 24 (2008) 505.
  7. Y. Ohmura and Y. Kuniyoshi: Proc. IEEE Int. Conf. Intelligent Robots and Systems (IEEE/RSJ IROS), 2007, p. 1136.
  8. K. Oliver, W. Karsten, and W. Heinz: Proc. IEEE Int. Conf. Intelligent Robots and Systems (IEEE/RSJ IROS), 2003, p. 1.
  9. B. Choi, S. Lee, H. R. Choi, and S. Kang: Proc. IEEE Int. Conf. Intelligent Robots and Systems (IEEE/RSJ IROS), 2006, p. 3779.
  10. W. L. Jin and C. D. Mote: Sens. Actuators A 65 (1998) 89.
  11. D. V. Dao, T. Toriyama, J. Wells, and S. Sugiyama: Sens. Mater. 15 (2003) 113.
  12. T. Mei, W. J. Li, Y. Ge, Y. Chen, L. Ni, and M. H. Chan: Sens. Actuators A 80 (2000) 155.
  13. Z. Chu, P. M. Sarro, and S. Middelhoek: Sens. Actuators A 54 (1996) 505.
  14. S. Takenawa: IEEE Int. Conf. Mechatronics, 2009, p. 1.
  15. K. Nishibori, K. Ishii, M. Konishi, and K. Oshima: Nihon Robot Gakkaishi 19 (2001) 882 [in Japanese].
  16. I. Kang, M. J. Schulz, J. H. Kim, V. Shanov, and D. Shi: Smart Mater. Struct. 15 (2006) 737.
  17. M. Knite, V. Tupureina, A. Fuith, J. Zavickis, and V. Teteris: Mater. Sci. Eng. C 27 (2007) 1125.
  18. Y. J. Yang, M. Y. Cheng, W. Y. Chang, L. C. Tsao, S. A. Yang, W. P. Shih, F. Y. Chang, S. H. Chang, and K. C. Fan: Sens. Actuators A 143 (2008) 143.
  19. M. Park, H. Kim, and J. P. Youngblood: Nanotechnology 19 (2008) 055705[IoP STACKS].
  20. X. Jiang, Y. Bin, and M. Matsuo: Polymer 46 (2005) 7418.
  21. F. Y. Chang, R. H. Wang, Y. H. Lin, T. M. Chen, and S. J. Huang: Thin Solid Films 518 (2010) 7343[CrossRef].
  22. Y. J. Yang, M. Y. Cheng, S. C. Shih, X. H. Huang, C. M. Tsao, F. Y. Chang, and K. C. Fan: Int. J. Adv. Manuf. Technol. 46 (2010) 945.
  23. F. Y. Chang, R. H. Wang, Y. H. Lin, T. M. Chen, Y. F. Lee, S. J. Huang, and C. M. Liu: Jpn. J. Appl. Phys. 50 (2011) 06GE08[JSAP].
  24. R. Zhang, M. Baxendale, and T. Peijs: Phys. Rev. B 76 (2007) 195433[APS].
  25. D. Stauffer and A. Aharony: Introduction to Percolation Theory (Taylor & Francis, London, 1985) 4th ed.
  26. G. T. Pham, Y. B. Park, Z. Liang, C. Zhang, and B. Wang: Composites B 39 (2008) 209.
  27. N. Hu, Y. Karube, C. Yan, Z. Masuda, and H. Fukunage: Acta Mater. 56 (2008) 2929.
  28. M. H. G. Wichmann, S. T. Buschhorn, L. Boger, R. Adeling, and K. Schulte: Nanotechnology 19 (2008) 475503[IoP STACKS].
  29. X. Song, S. Liu, Z. Gan, Q. Lv, H. Cao, and H. Yan: Proc. Electronic Components Technology Conf., 2009, p. 1297.
  30. N. K. Chang, C. C. Su, and S. H. Chang: Appl. Phys. Lett. 92 (2008) 063501[AIP Scitation].
  31. C. Stampfer, T. Helbling, D. Obergfell, B. Schöberle, M. K. Tripp, A. Jungen, S. Roth, V. M. Bright, and C. Hierold: Nano Lett. 6 (2006) 233[CrossRef].
|TOP|  |Previous Article| |Next Article|  |Table of Contents| |JJAP Home|
Copyright © 2013 The Japan Society of Applied Physics
Contact Information