We entered the very-large-scale-inteuration (VLSI) era in 1975. Since that time VLSI technoiugy has been, and continues to be, refined and improved. We have moved from diffusion to ion implantation, from wet etching to dry etching, and from contact printing to scanning projection or step-and-repeat lithography. By 1990 we will employ larger silicon wafers (∼150 mm in diameter), smaller feature lengths (∼0.5 µm), and lower processing temperatures (<900°C). Process simulation and advanced diagnostic techniques will be extensively used for on-line process design and for reliability analysis, respectively. Ultra-sophisticated chips with millions of components and on-chip system organizations will be built in response to the enormous market demand of the Information Age. This paper discusses those advances and future trends in VLSI technology.